Winpac Co., Ltd. is a specialized semiconductor post-processing (OSAT) company engaged in semiconductor packaging and testing businesses. Its headquarters are located at 50 Cheongganggachang-ro, Baegam-myeon, Cheoin-gu, Yongin-si, Gyeonggi-do, and the current CEO is Shin Dong-ho. The company is expanding its business in both memory and system semiconductor fields, with strengths in high-density packaging technology and providing turnkey solutions.

"Based on the vision of 'A company that creates value together,' Winpac Co., Ltd. is engaged in the semiconductor post-processing field. As a member of society, Winpac aims to redistribute profits to customers and employees to maintain a healthy company. We are prepared to strive for high-quality product production and price competitiveness for our customers, and for our employees, we will always endeavor to be a healthy and transparent company that focuses on employee welfare for a bright and enjoyable working environment, ensuring that profits generated by the efforts and hard work of our employees are fairly redistributed to both customers and employees."

Business Areas

• Semiconductor Packaging: It is a core post-processing step that protects semiconductor chips from the external environment and connects electrical signals to the mainboard. Winpac provides various packaging solutions such as FBGA, PoP, and MCP, and has strengths in high-density technology that stacks multiple chips vertically.
• Semiconductor Test: We provide both wafer testing conducted in the wafer state and final testing conducted in the final package form. We possess the technology to increase product yield and ensure reliability by utilizing high-performance testing equipment.
• System Semiconductor Packaging and Testing: We have successfully expanded our business from a memory semiconductor focus to the system semiconductor packaging and testing field. This allows us to achieve flexible responsiveness to market changes and diversification of our business portfolio.

Products

• FBGA (Fine Pitch Ball Grid Array): Fine Pitch Ball Grid Array is a form of semiconductor packaging that enables high-density connections and is primarily applied to IT devices requiring miniaturization and high performance, such as smartphones and tablets.
• PoP (Package on Package): This is an advanced stacking technology that layers memory packages on top of a processor. Through this, we possess the capability to respond to products requiring high performance and miniaturization.
• MCP (Multi Chip Package): This technology integrates multiple memory chips into a single package. High-density packaging contributes to improving product performance and increasing space efficiency.

Special Notes

• Provision of total semiconductor post-processing solutions: We possess core competitiveness in increasing customer supply chain management efficiency and shortening lead times through turnkey services that process packaging and testing in a single batch.
• High-density and next-generation packaging technology: We secure high-density and next-generation packaging technologies such as MCP, PoP, Flip Chip, and MUF methods to respond to high-performance products like smartphones, tablets, and HBM for AI and cloud servers.
• Diversification of business portfolio and stable customer base: We are expanding our business from memory semiconductors to system semiconductor packaging and testing, flexibly responding to market changes. Through a long-term partnership of over 10 years with SK Hynix, we have secured a stable revenue base.

Recruitment Information

• Main Hiring Positions: We primarily recruit for semiconductor PKG process technology, semiconductor production, and domestic sales positions.
• Benefits: We provide four major insurances, retirement pension, in-house clubs, sports events, various congratulatory and condolence fund support, birthday gifts, dormitory operation, in-house cafeteria, commuter bus, excellent employee awards, annual leave, health leave, and special occasion leave.

💡 A Word from JobPloy
Winpac Co., Ltd. is a specialized company in the semiconductor post-processing field, growing based on its packaging and testing technologies. Foreign workers are likely to work primarily in production or technical positions, and due to the nature of semiconductor processes, precision and consistency may be required. With well-equipped welfare benefits such as dormitories, in-house cafeterias, and commuter buses, a stable working environment can be expected.