Cressem Inc. is a small and medium-sized enterprise engaged in the manufacturing of machinery for semiconductor manufacturing, established in June 2014. Headquartered at 37, Venture-ro 36beon-gil, Yeonsu-gu, Incheon, it is led by CEO Oh Sang-min. The company develops and produces semiconductor inspection and repair equipment, packaging process equipment, and ultrasonic ACF bonding equipment.

"Cressem Inc. operates in the fields of inspection equipment for semiconductor packaging processes, including semiconductor substrates, wafers, and LED packages, as well as ultrasonic ACF bonding technology. Based on the philosophy of customer-centricity, talent-centricity, and technology-centricity, we pursue customer satisfaction through continuous R&D and by constantly pioneering domestic and international markets."

Business Areas

• Development and Production of Inspection Equipment for Semiconductor Packaging Processes: We develop and produce optimized equipment based on inspection, measurement, 2D & 3D sensors, AI libraries, optical, and robotic technologies required in the field of inspection equipment for manufacturing processes of semiconductor PCB substrates, LED packages, automotive electronic packages, and AI & memory packages.
• Provision of Ultrasonic ACF Bonding Technology and Equipment: We provide process technology, materials, and equipment related to ultrasonic ACF bonding required for the manufacturing of automotive electronic modules, displays, smart glass, semiconductor packages, and touch panels.
• Establishment of AI Vision Inspection In-line System: We have developed the industry's first Artificial Intelligence (AI) vision inspection in-line system, dramatically improving the efficiency of semiconductor back-end process inspection and contributing to labor reduction and improved inspection quality.

Products

• Semiconductor Substrate Inspection Equipment: We provide inspection solutions for complete quality control of various semiconductor substrates, from HBM to cutting-edge packaging. We achieve optimal ROI through customized equipment tailored to customer requirements.
• Ultrasonic ACF Bonding Equipment: We develop and supply ultrasonic ACF bonding equipment, which is essential for fine-pitch bonding below 50um, offering bonding speeds 2-3 times faster than conventional methods with minimal thermal deformation. It is used in the mass production of wearable and UHD display modules.
• Package Inspection Equipment: We provide inspection and measurement equipment for various semiconductor packages, including LED packages, automotive electronic packages, and AI & memory packages. Precise inspection is performed by integrating 2D & 3D sensors, AI libraries, and optical and robotic technologies.

Special Notes

• World's First AI-based In-line Inspection Technology: The semiconductor packaging inspection equipment utilizing Artificial Intelligence (AI) has achieved the world's first in-line inspection system, dramatically increasing inspection efficiency to the point where one person can handle the work previously done by 60 people.
• Customer-Tailored Optimized Equipment Development: Based on a deep understanding of customer needs, we provide optimal solutions by customizing platform-based hardware and software libraries. This enables the shortest development and production times in the industry and the achievement of optimal ROI.
• Continuous R&D and Technological Innovation: Under the philosophy of customer-centricity, talent-centricity, and technology-centricity, we conduct continuous research and development. We are leading innovative technologies in the semiconductor and display fields by undertaking national R&D projects related to interposers, signal integrity, and silicon bridges.

Recruitment Information

• Main Hiring Positions: AI R&D Engineer, Vision Development Team Developer, Semiconductor/PCB Inspection Equipment CS Engineer, Optical Engineer, Technical Sales Representative
• Benefits: 5 days a week (Mon-Fri) / 09:30 ~ 18:30 (Flexible working hours implemented), 4 major insurances, Courtyard (garden) within the research institute, Rest areas (cafeteria, etc.), Fitness room/shower room, Hobby room (screen golf, etc.), BBQ room, Sidiz chairs, Starbucks coffee provided, Long-term service awards, Flexible annual leave

💡 A Word from JobPloy
Cressem Inc. is a technology-oriented small and medium-sized enterprise that develops AI-based inspection equipment and ultrasonic ACF bonding equipment in the field of semiconductor manufacturing machinery. We primarily recruit for R&D, engineering, and technical sales positions, and offer excellent welfare benefits such as flexible working hours, four major insurances, and various rest and convenience facilities. It will be a great opportunity for those with an understanding of the semiconductor and display industries and technical capabilities. In particular, interest and willingness to learn about AI and optical technology can be advantageous for job adaptation.