HIMCHAN LASER Co., Ltd. is a company led by CEO Lee Kyung-sim, located in Hwaseong-si, Gyeonggi-do, engaged in the business of semiconductor equipment and laser processing in the field of other semiconductor device manufacturing.

业务领域

• 半导体设备加工: 为半导体制造过程中所需的设备及零件提供精密激光加工服务。
• 激光切割及钣金加工: 操作激光焊接机生产产品，并通过激光切割及钣金加工来加工精密零件。

产品

• 激光加工零件: 通过对半导体设备及其他工业精密零件进行激光切割、焊接、标记等多种加工服务，提供高质量的加工品。

特别事项

• 精密激光加工技术: 基于半导体器件和设备所需的高精度激光加工技术，能够实现复杂形状和微细加工。
• 专业的加工服务: 通过在半导体设备和激光领域的专业性，为客户提供满足其需求的定制化加工解决方案。

招聘信息

• 主要招聘岗位: 主要招聘操作激光焊接机、产品生产、激光切割及钣金作业、质量管理等生产岗位。
• 福利待遇: 提供每周5天工作制、四大保险加入、退休金制度运营等福利。

💡 JobPloy 的一句话
HIMCHAN LASER Co., Ltd. is a small manufacturing company specializing in semiconductor equipment and laser processing. As the main responsibilities will involve operating laser machines and production, a precise and meticulous work attitude is important. For foreign workers with a willingness to learn and a diligent attitude, this can be a good opportunity to learn specialized skills in a stable environment.