(주)원진하이텍

Registration : 2026. 04. 23

Recruiting Experienced Semiconductor Mold Profile Grinders

Gyeongnam Changwon-si Annual salary 60,000,000 KRW Manufacturing > Machine, equipment operation Deadline : 26. 06. 22 (Monday)
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Detailed work requirements

Grinding of product profiles for punches and dies, which are semiconductor mold (lead frame) components

Recruitment conditions

Resume, resume

Working conditions

Regular worker, Indefinite employment contract / No preference for dispatched work / No preference for hiring replacement personnel
Manufacturing > Machine, equipment operation
Weekdays: 8:00 AM – 8:00 PM (Mon-Fri) ※ Overtime on Wednesdays is flexible depending on alternating Saturday work (leaving at 5:00 PM, working on the 1st and 3rd weeks), 5-day work week, Average working hours: 40
Annual salary 60,000,000 KRW (Annual salary of 50,000,000 KRW or more ~ ​​60,000,000 KRW or less, negotiable after interview)

Employee benefits

National pension, Health Insurance, Employment Insurance, Industrial accident insurance
Retirement pension
Others (holiday gift certificates and twice-yearly productivity improvement incentives)

Site

경남 창원시 의창구 창원대로363번길 11

Company

(주)원진하이텍

About company

  • CEO

    박선호

  • Number of Employees

    11 ~ 50 people

  • Industry

    Mold and die manufacturing industry

  • Business Sector

    Semiconductor mold processing, connectors, and small automobile parts

  • Keyword

    -

Job Posting Information

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Job summary

  • Site
  • Gyeongnam Changwon-si
  • Salary
  • Annual salary 60,000,000 KRW (Annual salary of 50,000,000 KRW or more ~ ​​60,000,000 KRW or less, negotiable after interview)
  • Job position
  • Manufacturing > Machine, equipment operation
  • Lodging
  • Action required
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