（주）원진하이텍

Registration : 2026. 01. 12

Recruiting experienced semiconductor mold profile grinding employees

Gyeongnam Changwon-si Annual salary 60,000,000 KRW Manufacturing > Machine, equipment operation Until deadline : : 26. 03. 13 (Friday)
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Detailed work requirements

Profile grinding of punch and die products, which are semiconductor mold (lead frame) components

Recruitment conditions

Resume, resume

Working conditions

Regular worker, Indefinite employment contract/No desire for dispatched work/No desire for replacement personnel
Manufacturing > Machine, equipment operation
Weekdays: (A.M.) 8:00 - (P.M.) 8:00 (Monday, Tuesday, Thursday, Friday) ※ Overtime on Wednesdays is flexible depending on the Saturday biweekly work schedule (5:00 PM, 1st and 3rd week of work), 5 days a week, average working hours: 40
Annual salary 60,000,000 KRW (Annual salary: 50,000,000 won or more, up to 60,000,000 won, subject to adjustment after interview)

Employee benefits

National pension, Health Insurance, Employment Insurance, Industrial accident insurance
Retirement pension
Other (holiday gift certificates and twice-yearly productivity improvement incentives)

Site

경남 창원시 의창구 반계로 31

Company

（주）원진하이텍

About company

  • CEO

    박선호

  • Number of Employees

    11 ~ 50 people

  • Industry

    Mold and die manufacturing industry

  • Business Sector

    Semiconductor mold processing, connectors, and small automobile parts

  • Keyword

    -

Job Posting Information

This job posting is provided by WorkNet. Go to the job information site

Job summary

  • Site
  • Gyeongnam Changwon-si
  • Salary
  • Annual salary 60,000,000 KRW (Annual salary: 50,000,000 won or more, up to 60,000,000 won, subject to adjustment after interview)
  • Job position
  • Manufacturing > Machine, equipment operation
  • Lodging
  • Action required
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