（주）원진하이텍

Registration : 2025. 11. 03

Semiconductor Mold Molding Grinding New Employee Recruitment

Gyeongnam Changwon-si Hourly 10,030 KRW Manufacturing > Machine, equipment operation Until deadline : : 26. 01. 02 (Friday)
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Detailed work requirements

Profile grinding of punch and die products, which are semiconductor mold (lead frame) components

Recruitment conditions

Resume, resume

Working conditions

Regular worker, Indefinite employment contract/No desire for dispatched work/No desire for replacement personnel
Manufacturing > Machine, equipment operation
Weekdays: (A.M.) 8:00 - (P.M.) 8:00 (Monday, Tuesday, Thursday, Friday) ※ Overtime on Wednesdays is flexible due to the alternate-week Saturday work schedule (5:00 PM, 1st and 3rd week of work), and 5-day work week
Hourly 10,030 KRW (Hourly wage of 10,030 won or more, negotiable after interview)

Employee benefits

National pension, Health Insurance, Employment Insurance, Industrial accident insurance
Retirement pension
Other (holiday gift certificates and twice-yearly productivity improvement incentives)

Workplace

경남 창원시 의창구 반계로 31

Company

（주）원진하이텍

About company

  • Representative Name

    박선호

  • Number of Employees

    11 ~ 50 people

  • Capital

    -

  • Annual Revenue

    -

  • Industry

    Mold and die manufacturing industry

  • Business Sector

    Semiconductor mold processing, connectors, and small automobile parts

  • Keyword

    -

Job Posting Information

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