MOA TECH Co., Ltd. was established in 2004 and is a company specializing in precision surface treatment for semiconductor and electronic components. Located at 107-24, Jiwon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, it provides core solutions based on its proprietary technology in the field of surface treatment (plating) for electronic products.

"MOA TECH Co., Ltd., established in 2004, is a company specializing in precision surface treatment for semiconductor and electronic components. Based on its proprietary technology, it provides core surface treatment solutions that maximize the performance and reliability of advanced components such as semiconductor test sockets and connectors. Beyond simple service provision, the company supplies customized solutions optimized for the specific needs of its clients through its in-house process and equipment development capabilities, growing as a technology-intensive strong small company."

Business Areas

• Precision Surface Treatment Business for Semiconductor Components: This business involves selectively plating gold, silver, nickel, etc., on core areas of components used in semiconductor testing processes, such as LGA burn-in test sockets and probe card components. This enhances the electrical conductivity and wear resistance of the components, contributing to improved accuracy and efficiency in semiconductor testing.

Products

• Partial Plating for Semiconductor Test Sockets: This is a service that precisely plates precious metals such as gold and silver only on specific parts of the contact pins, which are core components of test sockets used for inspecting the performance of semiconductor chips. It possesses proprietary technology and automated equipment for selective plating only in the required areas through micrometer-level precision control.
• Socket Contact 3-Layer Partial Plating: Applied to various connector socket products such as Ni/Au/Sn partial plating and Ni Barrier implementation. By operating a dedicated line for heat-treated materials, it stably mass-produces high-difficulty 3-layer plating such as Ni+Pd-Ni+Au, Ni+Ag+Au, and Ni+Pd-Co+Au.
• Spot Drum · Stripe (Ni Barrier) Plating: It possesses Ni Barrier implementation technology through the Spot Drum & Stripe Au plating method applied only to specific areas. It also provides technology for applying Ni full plating to materials such as mobile phone SIM shells and metal shells.

Special Notes

• Proprietary Core Technology: Based on its proprietary core technology, the company has secured a differentiated competitive advantage in the field of precision surface treatment for semiconductor and electronic components, and is expanding its technology portfolio through continuous R&D investment.
• Customized Solution Provision: Through its in-house process and equipment development capabilities, the company supplies customized solutions optimized for the specific needs of its clients, growing as a technology-intensive strong small company.
• Stable Quality and Technology: Based on over 20 years of trust, the company is building customer trust with stable quality and solid technological prowess, showing strengths in technological completeness and commercialization capabilities compared to major competitors.

Recruitment Information

• Main Hiring Positions: Electroplating Production Manager
• Benefits: Provides National Pension, Employment Insurance, Industrial Accident Compensation Insurance, and Health Insurance.

💡 A Word from JOBPLOY
MOA TECH Co., Ltd. is a company with expertise in precision surface treatment and plating for electronic products. It primarily performs precision plating work for semiconductor components, making meticulousness and a willingness to learn technology important. For production positions, adapting to a precise work environment and striving for continuous technological development may be necessary.